Principal / Sr. Principal PCB Layout Design Engineer

About the role

Northrop Grumman Mission Systems in Woodland Hills, CA is seeking a Principal or Senior Principal PCB Layout Design Engineer to design high-reliability circuit card assemblies for aerospace, defense, and space flight applications. Fully onsite. Ability to obtain TS/SCI clearance required.

What you'll do

• Execute placement and routing of complex multi-layer PCBs (high-speed digital, RF, mixed-signal, power)
• Develop PCB layouts from electrical schematics and mechanical constraints
• Generate and maintain complete PCB/CCA fabrication and assembly documentation packages
• Apply IPC and high-reliability military/aerospace standards
• Support DFM, DFA, and DFT reviews; collaborate with fabrication and assembly suppliers
• (Sr. Principal) Lead advanced PCB efforts using HDI, microvias, via-in-pad technologies; mentor junior designers

Requirements

Principal (T03): BS engineering + 5 years aerospace (or MS + 2); ability to obtain TS/SCI; 3+ years Cadence Allegro or similar; multi-layer, high-density PCB experience.

Sr. Principal (T04): BS engineering + 8 years (or MS + 6, PhD + 4); same clearance and tool requirements.

Preferred: SI/PI analysis tools, defense/space program experience, 6+ years Cadence Allegro, advanced HDI/microvia expertise.

Pay & benefits

$114,000–$171,000/yr (Principal) · $142,200–$213,400/yr (Sr. Principal)

Health insurance, savings plan, PTO, bonus eligibility. Relocation assistance may be available.